Aldec makes available a ‘4k Ultra HD image pass through’ reference design for users of its Xilinx® Zynq® UltraScale+™ MPSoC embedded development kit TySOM-3-ZU7EV
Henderson, NV – October 15th, 2018 – Aldec, Inc., an industry leader in electronic design verification, announces the immediate availability of a 4k Ultra HD image transfer reference design for users of its TySOM™-3-ZU7EV embedded development kit.
The TySOM-3-ZU7EV features a Xilinx® Zynq® UltraScale+™ MPSoC device, which provides 64-bit processor (dual-core ARM® Cortex™) scalability and contains all the necessary connectivity and processing power to acquire, process and send high-resolution 4K (at 60fps) image data via the QSFP+ interconnect standard.
“Modern image broadcast technologies rely on real-time high-resolution image transmission, between an image producer and several image consumers,” comments Radek Nawrot, Director of Operations at Aldec. “To reduce bandwidth without sacrificing image quality, many emerging applications are calling for codec protocols such as QSFP+. Our reference design enables engineers to fast-track the implementation of 4k Ultra HD image transfer into their designs plus, of course, QSFP+ has applications outside of image transfer too.”
Aldec provides a HW/SW co-simulation solution for Zynq-based applications using Riviera-PRO™, the company’s popular functional verification tool, when used in conjunction with open-source Quick Emulation (QEMU).
Nawrot continues: “We’re keen to support our customers as much as possible and we’re delighted to have received very positive feedback on our ever-expanding range of reference designs, which allow engineers to accelerate their design and verification activities.”
A demonstration of the 4k Ultra HD image transfer reference design will be given on Aldec’s stand (617) at Arm TechCon 2018; October 16th to 18th, San Jose Convention Center.
The demo will see the connection (via QSFP+) of two TySOM-3-ZU7EV kits. One kit will also be connected to an FMC daughter card with a Leopard Imaging MIPI-FMC camera and act as an image capture and transmission (2160 pixels at 60Hz) unit. It will also display the captured image on a 4k monitor via TySOM’s HDMI socket. The other kit will receive and display the video, on a second 4k monitor, to demonstrate the high-speed, low-latency data transfer capabilities of the TySOM kits and reference design.
Above, and being showcased at Arm TechCon 2018, is the demo unit for Aldec’s 4k Ultra HD image transfer reference design, available for users the company’s TySOM™-3-ZU7EV embedded development kit.
About TySOM-3 Embedded Prototyping Board
TySOM-3-ZU7EV is a compact prototyping board containing a Zynq® UltraScale+™ MPSoC device which provides 64-bit processor scalability while combining real-time control with soft and hard engines for graphics, video, waveform, and packet processing. Xilinx Zynq UltraScale+ ZU7EV-FFVC1156 MPSoC contains a Video Codec Unit which supports H.264/H.265, and also has the biggest FPGA in the UltraScale+™ MPSoC family. This chip includes a Quad-core ARM Cortex-A53 as an Application Processing Unit, Dual-core ARM Cortex-R5 as a Real-Time Processing Unit and ARM Mali-400 MP2 as a Graphics Processing Unit. TySOM-3-ZU7 is designed to assure flexibility in selecting peripherals because of leveraging all the features of the Zynq UltraScale+ ZU7EV-FFVC1156 MPSoC chip. This prototyping board contains 4 GB DDR4 Memory for the Programmable Logic (PL) and support DDR4 SODIMM Memory for the Processing System (PS). This board includes 2 Gb NAND Memory and supports up to 32GB of SSD storage in Micro-SD card. Communication and networking is enabled by ×2 Gigabit Ethernet, Wi-Fi & Bluetooth, CAN, Pmod, 4× USB 3.0, USB to UART Bridge, SATA and QSFP+ connector. Multimedia interfaces are provided using DisplayPort, HDMI IN/OUT. To expand the peripherals, 2× FMC (1× HPC and 1× LPC) VITA 57.1-2010 compliant are provided on the board. Thus, additional devices can be connected as FMC Daughter Cards that are provided by Aldec and other vendors.
Aldec Inc., headquartered in Henderson, Nevada, is an industry leader in Electronic Design Verification and offers a patented technology suite including: RTL Design, RTL Simulators, Hardware-Assisted Verification, SoC and ASIC Emulation/Prototyping, Design Rule Checking, CDC Verification, IP Cores, Requirements Lifecycle Management, DO-254 Functional Verification, High-Performance Computing and Military/Aerospace solutions. www.aldec.com